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TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 1 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? applications 28-pin 5x5mm qfn package ? vsat ? point-to-point radio ? test equipment & sensors product features functional block diagram ? rf frequency range: 10 - 16 ghz ? if frequency: dc ? 3.5 ghz ? lo frequency: 6.5 ? 19 ghz ? lo input power: 0 to 6 dbm ? conversion gain: 17 db ? otoi: 33 dbm at max gain ? attenuation range: 15 db typical ? package dimensions: 5.0 x 5.0 x 1.3 mm general description pin configuration the triquint TGC2510-SM is a ku-band image reject up-converter with integrated lo buffer amplifier and output variable gain amplifier. the TGC2510-SM operates from an rf of 10 to 16 ghz and lo from 6.5 to 19 ghz with if inputs from dc to 3.5ghz and is designed using triquint?s phemt production process. the TGC2510-SM typically provides 33 dbm of output toi at ?10 dbm input power per tone and has a conversion gain of 17 db. the TGC2510-SM is available in a low-cost, surface mount 28 lead 5x5mm qfn package and is ideally suited for point-to-point radio, and ku-ban d vsat ground terminal. lead-free and rohs compliant. evaluation boards are available upon request. pin # function label 1, 7, 8, 9, 13, 14, 15, 16, 21, 22, 26, 28 gnd 2 rf out 3, 11, 18, 19, 20 nc 4 vctrl 5 vref 6 vgrf 10 if1 12 if2 17 lo in 23 vglo 24 vdlo 25 vgx 27 vdrf ordering information part no. eccn description TGC2510-SM ear99 ku-band upconverter standard t/r size = 500 pieces on a 13? reel. 2510 1249 5343
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 2 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? specifications absolute maximum ratings parameter rating vdrf 6 v vdlo 6 v idrf 350 ma idlo 100 ma vref 3 v vgrf, vglo, vgx -2 to +1.5 v vctrl 3 v if1, if2 -2 to +2 v rf input power, 50 , t = 25 c 10 dbm channel temperature, tch 200 c storage temperature -65 to 125 c operation of this device outside the parameter rang es given above may cause permanent damage. recommended operating conditions parameter min typ max units operating temp. range -40 +25 +85 c vdrf 5 v idrf 240 ma vgrf -0.70 v vdlo 5 v idlo 60 ma vglo -0.63 v vref 2 v vgx -1.2 v vctrl 0 v lo input power 0 6 dbm electrical specifications are measured at specified test conditions. specifications are not guaranteed ove r all recommended operating conditions. electrical specifications test conditions unless otherwise noted: if input power = -10 dbm, vgx = -1.2 v, vref = 2 v , vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vctrl = 0 v, for maximum gain. parameter conditions min typ max units rf frequency range 10 16 ghz lo frequency range 6.5 19 ghz if frequency range dc 3.5 ghz lo input power 0 6 dbm conversion gain 17 dbm oip3 33 dbm imr 20 db
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 ? 2012 triquint semiconductor, inc. specifications thermal and reliability information parameter thermal resistance, jc , measured to back of package channel temperature (tch), and median lifetime (tm ) channel temperature (tch), and median lifetime (tm) under rf drive - 3 of 22 - disclaimer: subject to change without notice connecting the digital world to the global network thermal and reliability information condition , measured to back of package tbase = 85 c channel temperature (tch), and median lifetime (tm ) tbase = 85 c, vdrf = 5 v, idrf = 240 ma vdlo = 5 v, idlo = 60 ma pdiss = 1.5 w channel temperature (tch), and median lifetime (tm) tbase = 85 c vdrf = 5 v, idrf = 240 ma vdlo = 5 v, idlo = 85 ma pin = -10 dbm pdiss = 1.63 w disclaimer: subject to change without notice digital world to the global network ? rating jc = 26.1 c/w tch = 124 c tm = 2.3 e+7 hours tch = 128 c tm = 1.4 e+7 hours
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 4 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? typical performance if input power = -10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = -1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling a pplied. 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 0 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 0 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 0 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -20 -15 -10 -5 0 5 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 2 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -20 -15 -10 -5 0 5 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 2 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 5 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? typical performance if input power = -10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = -1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling a pplied. -20 -15 -10 -5 0 5 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 2 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -20 -15 -10 -5 0 5 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 2 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 0 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 0 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 0 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 6 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? typical performance if input power = -10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = -1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling a pplied. 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 2 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 2 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 2 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 2 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 0 0.5 1 1.5 2 2.5 3 3.5 4 conversion gain (db) if frequency (ghz) conversion gain vs. if vs. rf vcontrol = 0 v, lo = 0 dbm, lsb, 25 c 10 ghz 13 ghz 16 ghz 0 5 10 15 20 25 0 0.5 1 1.5 2 2.5 3 3.5 4 conversion gain (db) if frequency (ghz) conversion gain vs. if vs. rf vcontrol = 0 v, lo = 0 dbm, usb, 25 c 10 ghz 13 ghz 16 ghz
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 7 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? typical performance if input power = -10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = -1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling a pplied 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 0 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 0 0.5 1 1.5 2 2.5 3 3.5 4 conversion gain (db) if frequency (ghz) conversion gain vs. if vs. rf vcontrol = 0 v, lo = 6 dbm, lsb, 25 c 10 ghz 13 ghz 16 ghz 0 5 10 15 20 25 0 0.5 1 1.5 2 2.5 3 3.5 4 conversion gain (db) if frequency (ghz) conversion gain vs. if vs. rf vcontrol = 0 v, lo = 6 dbm, usb, 25 c 10 ghz 13 ghz 16 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 0 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 0 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 8 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? typical performance if input power = -10 dbm, vdlo = 5 v, idlo = 60 ma , vdrf = 5 v, idrf = 240 ma, vgx = -1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling a pplied. 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 2 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 2 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 2 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 2 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 2 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l-i isolation vs. lo frequency vcontrol = 0 v, usb, 25 c lo = 0 dbm lo = 6 dbm 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l-i isolation vs. lo frequency vcontrol = 0 v, lsb, 25 c lo = 0 dbm lo = 6 dbm
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 9 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? typical performance if input power = -10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = -1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling a pplied. 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l-r isolation vs. lo frequency vcontrol = 0 v, lsb, 25 c lo = 0 dbm lo = 6 dbm 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l-i isolation vs. lo frequency vcontrol = 2 v, lsb, 25 c lo = 0 dbm lo = 6 dbm 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l-r isolation vs. lo frequency vcontrol = 2 v, lsb, 25 c lo = 0 dbm lo = 6 dbm 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l-i isolation vs. lo frequency vcontrol = 2 v, usb, 25 c lo = 0 dbm lo = 6 dbm 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (dbm) lo frequency (ghz) l-r isolation vs. lo frequency vcontrol = 0 v, usb, 25 c lo = 0 dbm lo = 6 dbm 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l-r isolation vs. lo frequency vcontrol = 2 v, usb, 25 c lo = 0 dbm lo = 6 dbm
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 10 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? typical performance if input power = -10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = -1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling a pplied 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 0 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 2 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 0 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 0 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 2 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 11 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? typical performance if input power = -10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = -1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling a pplied -5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 0 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 2 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 2 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 0 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 0 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 12 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? typical performance if input power = -10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = -1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling a pplied. -5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 2 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 2 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 2 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 2 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz -1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 10 11 12 13 14 15 16 voltage (v) lo frequency (ghz) nulling voltages vs. lo frequency lo at 3 dbm, if = 2.5 ghz, usb, 25 c vdi_min gain vdi_max gain vdq_min gain vdq_max gain -1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 10 11 12 13 14 15 16 voltage (v) lo frequency (ghz) nulling voltages vs. lo frequency lo at 3 dbm, if = 3.5 ghz, usb, 25 c vdi_min gain vdi_max gain vdq_min gain vdq_max gain
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 13 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? typical performance if input power = -10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = -1.2 v, vref = 2 v data taken with external if hybrid and lo nulling a pplied. 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. temperature vcontrol = 0 v, lo = 0 dbm, usb 85 c 25 c -40 c if @ 2.0 ghz 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. temperature vcontrol = 0 v, lo = 0 dbm, usb 85 c 25 c -40 c if @ 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output vs. temperature vcontrol = 0 v, lo = 6 dbm, usb 85 c 25 c -40 c if @ 2.0 ghz 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. temperature vcontrol = 0 v, lo = 0 dbm, lsb 85 c 25 c -40 c if = 2.0 ghz 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. temperature vcontrol = 0 v, lo = 0 dbm, lsb 85 c 25 c -40 c if = 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output vs. temperature vcontrol = 0 v, lo = 6 dbm, lsb 85 c 25 c -40 c if = 2.0 ghz
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 14 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? typical performance if input power = -10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = -1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling a pplied 0 10 20 30 40 50 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output vs. temperature vcontrol = 0 v, lo = 6 dbm, usb 85 c 25 c -40 c if @ 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output vs. temperature vcontrol = 0 v, lo = 6 dbm, lsb 85 c 25 c -40 c if = 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output vs. temperature vcontrol = 0 v, lo = 0 dbm, lsb 85 c 25 c -40 c if = 2.0 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output vs. temperature vcontrol = 0 v, lo = 0 dbm, lsb 85 c 25 c -40 c if = 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output vs. temperature vcontrol = 0 v, lo = 0 dbm, usb 85 c 25 c -40 c if @ 2.0 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output vs. temperature vcontrol = 0 v, lo = 0 dbm, usb 85 c 25 c -40 c if @ 3.5 ghz
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 15 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? typical performance if input power = -10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = -1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling a pplied m x n spurious outputs for lsb lo = 0 ? 6 dbm, 25 c; all values are in dbc. for lsb if = 2.0 ghz: lo = 12.0 ghz to 18.0 ghz; i f = 3.5 ghz: lo = 13.5 ghz to 19.0 ghz. m x n spurious outputs for usb lo = 0 ? 6 dbm, 25 c; all values are in dbc. for usb if = 2.0 ghz: lo = 8.0 ghz to 14.0 ghz; if = 3.5 ghz: lo = 6.5 ghz to 12.5 ghz. rf/lo 0 1 2 3 -3 --- 70 79 76 -2 --- 44 40 75 -1 --- 0 38 69 0 --- 24 30 38 1 61 24 69 68 2 62 44 79 75 3 72 78 78 76 spurious suppresion (dbc) for if = 2.0 ghz rf/lo 0 1 2 3 -3 --- 84 75 73 -2 --- 50 45 71 -1 --- 0 59 63 0 --- 21 28 34 1 51 27 64 69 2 49 64 74 74 3 85 77 70 --- spurious suppresion (dbc) for if = 3.5 ghz rf/lo 0 1 2 3 -3 --- 70 46 44 -2 --- 46 29 54 -1 --- 17 20 15 0 --- 23 -17 25 1 56 0 8 26 2 28 33 32 62 3 48 43 66 71 spurious suppresion (dbc) for if = 2.0 ghz rf/lo 0 1 2 3 -3 --- 62 66 49 -2 --- 70 33 41 -1 --- 23 8 14 0 --- 19 -29 -17 1 23 0 4 11 2 27 30 38 41 3 56 58 64 72 spurious suppresion (dbc) for if = 3.5 ghz
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 16 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? pin description top view pin symbol description 1, 7, 8, 9, 13, 14, 15, 16, 21, 22, 26, 28 gnd internal grounding; must be grounded on pcb. 2 rf out rf output matched to 50 ohms, ac coupled. 3, 11, 18, 19, 20 nc no internal connection; must b e grounded on pcb. 4 vctrl control voltage. bias network is required; see app lication circuit on page 17 as an example. 5 vref reference voltage. bias network is required; see ap plication circuit on page 17 as an example. 6 vgrf rf gate voltage. bias network is required; see application circuit o n page 17 as an example. 10 if1 if input matched to 50 ohms, dc coupled. 12 if2 if input matched to 50 ohms, dc coupled. 17 lo in lo input, matched to 50 ohms, ac coupled. 23 vglo lo gate voltage. bias network is required; see appl ication circuit on page 17 as an example. 24 vdlo lo drain voltage. bias network is required; see app lication circuit on page 17 as an example. 25 vgx mixer voltage. bias network is required; see applic ation circuit on page 17 as an example. 27 vdrf rf drain voltage. bias network is required; see app lication circuit on page 17 as an example. 29 gnd backside paddle. multiple vias should be employed to minimize inductance and thermal resistance; see mounting con figuration on page 20 for suggested footprint.
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 17 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? application circuit biasing procedures bias up bias down set vgx to -1.2 v turn off rf signal set vref to 2.0 v reduce vdlo to 0 v set vctrl to 0 v reduce vdrf to 0 v set vglo to -1.5 v set vdi to 0 v, if used for lo nulling set vdlo to 5.0 v set vdq to 0 v, if used for l o nulling increase vglo to get idlo = 60 ma reduce vglo to 0 v set vgrf to -1.5 v reduce vgrf to 0 v set vdrf to 5.0 v reduce vref to 0 v increase vgrf to get idrf = 240 ma reduce vctrl t o 0 v set vdi, vdq to 0 v; or no connection reduce vgx to 0 v apply rf signal vgrf lo input if input 2510 yyww xxxx rf output vref vctrl if input vdi vdq vglo vdlo vdrf vgx usb lsb
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 18 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? application circuit pc board layout board material is ro4003 0.008? thickness with ? oz copper cladding. for further technical information, refer to the TGC2510-SM product information page . bill of material ref des value description manufacturer part number c1 ? c2 10 pf cap, 0402, 50v, 5%, npo various c3 ? c9 100 pf cap, 0402, 50v, 5%, npo various c10 ? c13 0.01 f cap, 0805, 25v, 5%, cog various c14 ? c17 1 f cap, 0805, 25v, 5%, x5r various l1 ? l4 27 nh ind, 0201, 100 ma, 5%, smd various r1 0 res, 0402, 0.01w, smd various r2 50 res, 0402, 0.05w, 0.1%, smd various x1 power splitter mini-circuits qcn-25+ or qcn45+ u1 ku-band up-converter triquint TGC2510-SM x1 x1 r1 r2 lsb configuration x1 u1 x1 c8 c9 c7 c1 c2 c3 c6 c5 c4 c10 c11 c12 c14 c17 c13 c15 c16 l1 r1 l2 l3 l4 r2
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 19 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? mechanical information package information and dimensions all dimensions are in millimeters. the TGC2510-SM will be marked with the ?2510? desig nator and a lot code marked below the part designat or. the ?yy? represents the last two digits of the year the part was manufactured, the ?ww? is the work we ek, and the ?xxxx? is an auto-generated number. this package is lead-free/rohs-compliant with a cop per alloy base (cda194), and the plating material o n the leads is nipdau. it is compatible with lead-free (m aximum 260 c reflow temperature) soldering process es.
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 20 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? mechanical information pcb mounting pattern all dimensions are in millimeters . notes: 1. the pad pattern shown has been developed and tes ted for optimized assembly at triquint semiconductor. the pcb land p attern has been developed to accommodate lead and package tolerance s. since surface mount processes vary from company to compan y, careful process development is recommended. 2. ground / thermal vias are critical for the prope r performance of this device. vias should use a .35mm diameter drill and have a final plated thru diameter of .25 mm. tape and reel information tape and reel specifications for this part are also available on the triquint website in the ?applicat ion notes? section. standard t/r size = 500 pieces on a 13? reel. material cavity (mm) distance between centerline (mm) carrier tape (mm) cover tape (mm) vendor vendor p/n length (a0) width (b0) depth (k0) pitch (p1) length direction (p2) width direction (f) width (w) width (w) advantek bcc5x5-b 5.25 5.25 1.8 8.0 2.00 5.50 12.0 9.20
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 ? 2012 triquint semiconductor, inc. product compliance information esd information esd rating: tbd value: passes tbd v min. test: human body model (hbm) standard: jedec standard jesd22 msl rating moisture sensitivity level (msl) tbd at 260c reflow per jedec standard ipc/jedec j recommended soldering temperature profile - 21 of 22 - disclaimer: subject to change without notice connecting the digital world to the global network product compliance information human body model (hbm) jedec standard jesd22 -a114 solderability compatible with lead-free soldering processes, 260 c maximum reflow temp package lead plating: nipdau the use of no- clean solder to avoid washing after soldering is recommended. this package is not compatible with containing lead . rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp-a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free at 260c convection standard ipc/jedec j -std-020. recommended soldering temperature profile disclaimer: subject to change without notice digital world to the global network ? soldering processes, reflow temp erature. package lead plating: nipdau clean solder to avoid washing after compatible with solder compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and this product also has the following attributes: halogen free (chlorine, bromine) ) free
TGC2510-SM ku-band upconverter preliminary data sheet: rev b 10/11/12 - 22 of 22 - disclaimer: subject to change withou t notice ? 2012 triquint semiconductor, inc. connecting the digital world t o the global network ? contact information for the latest specifications, additional product i nformation, worldwide sales and distribution locati ons, and information about triquint: web: www.triquint.com tel: +1.972.994.8465 email: info-sales@tqs.com fax: +1.972.994.8504 for technical questions and application information : email: info-networks@tqs.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding t he information contained herein. triquint assumes no responsibility or liability whatsoever for any of t he information contained herein. triquint assumes no responsibili ty or liability whatsoever for the use of the infor mation contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is ent irely with the user. all information contained her ein is subject to change without notice. customers should obtain and verify the latest relevant information before plac ing orders for triquint products. the information contained herei n or any use of such information does not grant, ex plicitly or implicitly, to any party any patent rights, license s, or any other intellectual property rights, wheth er with regard to such information itself or anything described by su ch information. triquint products are not warranted or authorized f or use as critical components in medical, life-savi ng, or life- sustaining applications, or other applications wher e a failure would reasonably be expected to cause s evere personal injury or death.

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